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New materials will help to dissipate heat when used in next-generation power device heat sinks; process suggestions and prototype supply can also be provided according to customer needs

Tokyo, July 20, 2021/PRNewswire/ - TANAKA Holdings Co., Ltd. (headquarters: Chiyoda-ku, Tokyo; representative director and CEO: Koichiro Tanaka) today announced that TANAKA Kikinzoku Kogyo KK (headquarters: Tokyo Chiyoda Ward), Tokyo; Representative Director and CEO: Koichiro Tanaka (Koichiro Tanaka) manages Tanaka Precious Metals manufacturing business and has developed an active brazing metal/copper composite material for power devices that can shorten processing time.

The new product is a composite material (cladding) of copper (Cu) material with active solder on one side. Since it can be directly bonded to any material including ceramics (oxides, nitrides, and carbides) and carbon materials, it is expected to be used for ceramic substrates and next-generation power device heat sinks. In addition, Tanaka can also make various suggestions based on customer needs, from the supply of prototypes using this product to brazing1 process, testing and evaluation.

Product features and new processing solutions: both high heat dissipation and labor-saving processing

In addition, the brazing time can be greatly shortened, which saves energy and is expected to reduce the impact on the environment. 

Due to the above characteristics, the product can be used in a wide range of semiconductor applications, especially in the field of heat dissipation, the deployment expectation is high.

Contribution potential of this product in individual heat dissipation areas

In the power device market, higher output and higher efficiency are required. Accompanying this, the amount of heat is also increasing. Therefore, providing a single component with high heat dissipation, high heat resistance, and high bonding reliability and developing materials compatible with further miniaturization are urgent tasks for the industry. This is especially true in the market for environmentally friendly vehicles such as electric vehicles (EV) and hybrid vehicles (HV), the high-output laser diode market, and the next-generation radiator market. 3 PCs, smartphones, and other markets are expected to grow. In order to maintain high heat dissipation, high heat resistance and high bonding reliability, it is first necessary to increase the thickness of the Cu plate. This product can form electrodes on thick Cu materials and improve bonding reliability without the use of etching, so it can be expected to have Contribute to higher heat dissipation.

Tanaka plans to start full sample shipments in 2021 and establish a mass production system in 2023

Looking to the future, Tanaka will continue to develop products that meet customer needs and focus on technology development to expand its active solder lineup.

1 Brazing is a joining method that melts the alloy (brazing filler metal) whose melting point is lower than that of the base material to be joined and melts the metal or other materials of the base material as little as possible.

2 Etching is also called chemical etching. Etching is a process of obtaining a desired shape by dissolving and eroding unwanted areas.

3 Radiator is a mechanical part used to dissipate heat and absorb heat. Heat sinks are usually made of metals with good thermal conductivity, such as aluminum, iron, or copper, but graphite is also attracting attention as the next generation of heat sinks. Applications include cooling semiconductor components, coolers in refrigerators and air conditioners, and radiators and heaters in automobiles.

Tanaka's active solder

The active brazing filler metal used is an updated version of the earlier product, and silver (Ag), copper (Cu), tin (Sn) and titanium (Ti) can be used for brazing ceramics. AgCuSnTi alloy can be dispersed finer than SnTi alloy, and supports the manufacture and supply of products with thin solder.

TANAKA Holdings Co., Ltd. (Tanaka Kikinzoku's holding company)

Headquarters: 2-7-3 Marunouchi, Chiyoda-ku, Tokyo 22F, Tokyo Building Representative: Koichiro Tanaka, representative director and chief executive officer Date of establishment: 1885 Date of establishment: 1918* Capital: 500 million yen Consolidated group employees: 5,193 ( (2020 fiscal year) consolidated group sales: 1,425.617 billion yen (2020 fiscal year) Main business: Tanaka Kikinzoku's core holding company, responsible for strategic and efficient group operations and management guidance to group companies.

URL: https://www.tanaka.co.jp/english/ * TANAKA Holdings adopted a holding company structure on April 1, 2010.

Tanaka Precious Metals Industry Co., Ltd.

Headquarters: 2-7-3 Marunouchi, Chiyoda-ku, Tokyo, 22nd floor, Tokyo Building Representative: Koichiro Tanaka, representative director and chief executive officer Date of establishment: 1885 Date of establishment: 1918 Capital: 500 million yen Employees: 2,453 (as of 2021 March 31) Sales: 1,251,066,897,000 yen (2020 fiscal year) Main business: manufacturing, sales, import and export of precious metals (platinum, gold, silver, etc.) and various industrial precious metal products.

Since its establishment in 1885, Tanaka Precious Metals has carried out diversified business activities centered on precious metals. TANAKA is a leader in Japan in terms of precious metal processing capacity. For many years, Tanaka has not only manufactured and sold industrial precious metal products, but also provided precious metals in the form of jewelry and resources. As precious metals experts, all group companies in Japan and abroad provide products and services through unified cooperation in manufacturing, sales, and technology. In addition, in order to further promote the globalization process, Tanaka Kikinzoku Kogyo Co., Ltd. welcomed Metalor Technology International Co., Ltd. as a member of the group in 2016.

As a precious metal professional, Tanaka precious metals will continue to contribute to the construction of a prosperous and prosperous society.

The five core companies that make up Tanaka Precious Metals are as follows.

Media inquiries: Tanaka Holdings Co., Ltd., https://tanaka-preciousmetals.com/en/inquiries-for-media/

Source: Tanaka Holdings Co., Ltd.